| Term |
Definition |
| T |
back to top |
| TAB |
see Tape Automated Bonding |
| Tape & Reel |
(1) A package form that allows the feeding of components to a
placement machine, consisting of cover and carrier tapes and a reel.
(2) A package form that allows the feeding of components to an insertion
machine, consisting of a roll of components held in place by at
least one pair of thin adhesive tapes positioned face to face and
a reel. |
| Tape Automated
Bonding (TAB) |
A high lead count SMT integrated circuit package aimed at very
high volume products and specialized low volume products, requiring
secondary processing with specialized machinery. |
| Tape Ball Grid
Array (TBGA) |
A brand name for TAB package form. |
| Tape Carrier
Package |
A brand name for Tape Automated Bonding (TAB). |
| Tape, Carrier |
The part of the tape of a tape and reel with a pocket and sprocket
holes that presents a part for pickup. |
| Tape, Cover |
The part of a tape and reel that holds a component in the pocket
of the carrier tape. |
| TB-BGA |
Top-Bottom Ball Grid Array |
| TBGA |
see Tape Ball Grid Array |
| TCP |
see Tape Carrier Package |
| TDMA (Time Division Multiple
Access) |
A technology for digital transmission of radio signals between,
for example, a mobile telephone and a radio base station. In TDMA,
the frequency band is split into a number of channels which in turn
are stacked into short time units so that several calls can share
a single channel without interfering with one another. Networks
using TDMA assign 6 timeslots for each frequency channel. TDMA is
also the name of a digital technology based on the IS-136 standard.
TDMA is the current designation for what was formerly known as D-AMPS.
|
| Technology Buy |
Purchases of advanced equipment for developing next generation
technologies and other R&D, as opposed to a capacity buy. |
| Telcordia (formerly Bellcore)
|
Generic requirements for reliability of telecommunications equipment.
Components and devices that are incorporated into the communications
infrastructure need to be tested to ensure they meet Telcordia performance
standards. |
| TEM |
see Transmission Electron
Microscope |
| Terabyte |
A unit denoting one trillion (10 12 ) bytes. |
| Test development |
Ability to design and deploy a specific type of test. The test
could be for functionality, manufacturability, reliability or qualification. |
| Test Engineering |
The technical organization that is usually responsible for the
testing of assemblies that are being manufactured.
|
| Test Fixture |
Equipment that interfaces between test equipment and the unit
being tested. |
| Test Pad |
see Pad, Test |
| Test Point |
A node with specific access to an electrical circuit used for
electrical testing purposes. |
| Test Strategy |
Ability to design a test using the most cost-effective test techniques
to ensure the item being tested functions correctly. |
| Test,
Assembly, and Packaging (TAP) |
Test, assembly and packaging or the back-end of semiconductor
manufacturing (BEOL) |
| Test, Automated |
Computer controlled electrical testing of parts, assemblies,
or finished products. |
| Test, Built-In (BIT) |
An electrical testing technique which adds hardware to the chip
to allow the integrated circuit to test itself with minimal use
of test equipment. |
| Test, Combinational |
A test method that uses automatic test equipment to measure component
parameters (i.e., in-circuit testing) and performance (i.e., functional
testing). |
| Test, Functional |
An electrical test of an assembly under actual operating conditions. |
| Test, In-Circuit
(ICT) |
An automated test method that measures parameters such as continuity
and short and open circuits on an assembled printed circuit board.
It also tests components mounted on the printed circuit board. |
| Test,
Manufacturing Defects Analyzer (MDA) |
An automated test that measures component values, but does not
supply power to the printed circuit board. |
| Testing |
Providing ways to check the functionality of components, sub-assemblies,
assemblies and/or a finished product. Tests can include: in-circuit
tests, functional tests and systems tests. |
| THB |
Temperature humidity test for bias.
|
| Thermal Analysis |
An analysis to determine how much heat is generated by components
as well as ambient temperatures within an enclosure.
|
| Thermal Forming |
The process of forming plastic materials which are heated and
formed over or into dies or patterns and may involve pressure or
vacuum assistance.
|
| Thin Film Filters |
Thin film filters are used heavily in DWDM systems to separate
wavelengths in MUX/DMUX devices. Thin film filters are formed by
depositing numerous layers of dielectric coatings on a silica, quartz,
or polymer substrate. The thin film process can also be used to
make other similar optical components like attenuators, isolators,
and others. |
| Thin Small
Outline Package (TSOP) |
An integrated circuit SMT package with two parallel rows of 20
to 48 gull-wing leads. The pitch is 20 mils. |
| Through Hole |
see Plated-Through-Hole
(PTH) |
| THT |
see Pin-Through-Hole
(PTH) (Through Hole Technology) |
| TIA (Telecommunications Industry
Association) |
One of the Telecommunications standards setting bodies in the
United States.
|
| Tinning |
The coating of a surface with a uniform layer of solder. |
| Tooling |
Tool Making |
| Tooling Hole |
Alignment Hole. A non-plated hole on a printed circuit board
that provides for registration and hold-down during manufacturing
processes. |
| Touch-Up |
Rework |
| TQFP |
Tape Quad Flat Package |
| Training and
Start-up |
Ability to do designs that comprise the interaction and integration
of various sub-assemblies into a single assembly to accomplish an
intended function. The sub-assemblies can consist of electrical,
mechanical, optical, software, acoustical and other components to
achieve overall functionality. Examples of systems design include
designing a PC, a cellular phone or a pager. |
| Transceiver |
A transmitter and receiver contained in one package. A 2-way
radio or cell phone is an example of a transceiver.
|
| Transistors |
An active semiconductor device capable of providing power amplification.
Transistors have three or more terminals.
|
| Transmission
Electron Microscope (TEM) |
Developed earlier than the scanning electron microscope (SEM)
and differs in a number of fundamental ways. First, while the SEM
uses an electron beam to excite secondary electrons from the sample's
surface, the TEM sends electrons directly through the sample. Second,
while the SEM uses the information gained from the detected secondary
electrons to produce an image on a computer monitor, the image viewed
using a TEM is in essence the sample's shadow. Electrons that pass
through the sample brighten the fluorescent viewing screen, while
the screen remains darker beneath parts of the sample which do not
yield as easily to electrons. |
| Trim Die |
A die or fixture used as a secondary operation to trim excess
material from a fabricated part.
|
| TSOP |
see Thin Small Outline Package |
| TTE |
Telecommunications Terminal Equipment |
| Tube |
A type of packaging used to supply parts, usually ICs. |
| Turnkey |
A type of outsourcing method that turns over to the subcontractor
all aspects of manufacturing including material acquisition, assembly
and testing. Its opposite is consignment, where the outsourcing
company provides all materials required for the products and the
subcontractor provides only assembly equipment and labor.
|
| Turret Head |
A pick-up and placement head with multiple pick-up locations
that generally rotates parallel to the printed circuit board. |
| Twist |
A diagonal corner to diagonal corner variation from known flatness
of a printed circuit board. |
| Type I Assembly |
A surface mount assembly with surface mount components on one
or both sides of the substrate. |
| Type II Assembly |
A surface mount assembly with surface mount components on one
or both sides of the substrate and through hole devices on the primary
side. |
| Type III Assembly |
A surface mount assembly with surface mount components on the
secondary side of a PCB and through hole devices on the primary
side. |
| U |
back to top |
| UL |
Underwriters Laboratories (UL). A U.S. safety standard certification
organization. |
| Ultrasonic |
Using frequencies above 20,000 hertz in cleaning technology or
wave solder flux dispensing. |
| Unsupported Hole |
A hole containing no plating or other type of conductive reinforcement. |
| UUT (Unit Under Test) |
An acronym describing any type of electrical apparatus connected
to test instrumentation. The apparatus can range from a simple circuit
or a complex subsystem such as a mobile phone, base station or MSC. |
| UV |
Ultraviolet |
| V |
back to top |
| Vacuum Forming |
see Thermal Forming.
|
| Vapor Phase Soldering |
Vapor phase (condensation) soldering uses the high-temperature
vapor of a boiling perfluorinated hydrocarbon as the heat transfer
medium. Also known as condensation inert soldering. |
| VHF (Very High Frequency) |
The RF spectrum between 30 MHz and 300 MHz.
|
| Via |
A plated-through hole used as a through connection between layers
on the printed circuit board. Vias are not intended to be used for
component lead insertion. |
| Via Tenting |
A via that is covered with material to prevent contact with process
materials. A printed circuit board assembly set which covers a plated
via and the surrounding area with solder mask. |
| Via, Blind |
A via extending between inner layers and one outer surface of
a multilayer printed circuit board. |
| Via, Thermal |
A plated via positioned to remove heat from a component. |
| VLSI |
Very Large Scale Integration |
| VMI |
Vendor Managed Inventory (VMI) or Supplier Managed Inventory
(SMI). A process whereby raw materials or assemblies are owned by
the supplier at a buffer location close to the factory and pulled
in a just-in-time manner to the production floor. The supplier plans
and manages production to maintain a minimum saefty stock level
in the buffer according to the factory forecast (usually 1-2 weeks).
Designed to create a more responsive suply chain with less inventory.
|
| W |
back to top |
| W-CDMA (Wideband-Code Division
Multiple Access) |
A 3G radio interface using DSSS, and both Frequency Division
(FDD) and Time Division Duplexing (TDD) depending on the frequency
assignment. The earlier Japanese W-CDMA trial system and the European
UMTS have both served as a foundation for the workings of the current
harmonized W-CDMA system, under the supervision of the 3GPP.
|
| Wave Soldering |
(1) A conduction machine soldering process that brings a printed
circuit assembly in contact with the surface of continuously flowing
and circulating molten solder. (2) A machine that creates solder
joints by contacting the bottom side terminations on a board with
the molten solder. This contact makes the connections as wave pressure,
wetting, and capillary action force the solder to flow up holes
and component leads to wet them to the board surface. |
| Wave Soldering,
Dual |
A wave soldering process consisting of an initial turbulent wave
followed by a laminar (flat) wave used for two sided SMT printed
circuit boards. The turbulent wave ensure full solder coverage.
The laminar wave removes shorts, bridges, and icicles. |
| Wave Soldering,
Selective |
(1) Using a pallet to allow only selected areas on a printed
circuit board to contact the solder wave and to protect other areas
of the board from contact with the wave. (2) Using a solder fountain
(a specialized soldering machine) and specialized chimneys to solder
only selected area on a printed circuit board. |
| Weilbull distribution |
A statistical tool for analyzing failure data.
|
| Welding |
A metallurgical joining process of metals using diffusion and
intermetallic formations. |
| Wet Etching |
Etching away of layers on a wafer by immersion in a chemical
bath. |
| White box |
Build a unit of our own design with an end customer’s label (e.g.
VAR/reseller) to an individual order, including required peripherals
and software. Ships direct to the customer. |
| WLAN (Wireless Local Area
Network) |
A wireless version of the LAN. Provides access to the LAN even
when the user is not in the office.
|
| WIP |
Work In Process |
| X |
back to top |
| X-Ray |
A ray or radiation of very short wave-length, that can penetrate
solid substances.
|
| XML |
A group of separate systems that work seamlessly together that
enables companies to perform end to end Electronic Commerce
|
| XRF |
X-ray fluorescence.
|
| Y |
back to top |
| Yield |
First Pass Yield |
| Z |
back to top |
| ZD |
Zero Defects |
